Victoria Shao
Research Interests
- Electromagnetic compatibility/interference (EMC/EMI), Signal and power integrity analysis (SI/PI), Computational electromagnetics (CEM), High-power microwave, and Multi-physics analysis.
Research Areas
- Electromagnetic compatibility
Selected Articles in Journals
- S. Wang, Y. Shao and Z. Peng, "A Parallel-in-Space-and-Time Method for Transient Electromagnetic Problems," IEEE Transactions on Antennas and Propagation, vol. 67, no. 6, pp. 3961-3973, June 2019.
- B. MacKie-Mason, Y. Shao, A. Greenwood and Z. Peng, "Supercomputing-Enabled First-Principles Analysis of Radio Wave Propagation in Urban Environments," IEEE Transactions on Antennas and Propagation, vol. 66, no. 12, pp. 6606-6617, Dec. 2018.
- Z. Peng, Y. Shao, H. Gao, S. Wang and S. Lin, "High-Fidelity, High-Performance Computational Algorithms for Intrasystem Electromagnetic Interference Analysis of IC and Electronics," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 5, pp. 653-668, May 2017.
- Z. Peng, R. Hiptmair, Y. Shao and B. MacKie-Mason, "Domain Decomposition Preconditioning for Surface Integral Equations in Solving Challenging Electromagnetic Scattering Problems," IEEE Transactions on Antennas and Propagation, vol. 64, no. 1, pp. 210-223, Jan. 2016.
- Y. Shao, Z. Peng and J. Lee, "Thermal Analysis of High-Power Integrated Circuits and Packages Using Nonconformal Domain Decomposition Method," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 8, pp. 1321-1331, Aug. 2013.
- Y. Shao, Z. Peng, K. H. Lim and J.-F. Lee, "Non-conformal Domain Decomposition Methods for Time-harmonic Maxwell Equations," Proceedings of the Royal Society A, vol. 468, no. 2145, pp. 2433-2460, Sept. 2012.
- Y. Shao, Z. Peng and J.-F. Lee, "Thermal-aware DC IR-drop co-analysis using non-conformal domain decomposition methods," Proceedings of the Royal Society A, vol. 468, no. 2142, pp. 1652-1675, Feb. 2012.
- Y. Shao, Z. Peng and J. Lee, "Signal Integrity Analysis of High-Speed Interconnects by Using Nonconformal Domain Decomposition Method," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 1, pp. 122-130, Jan. 2012.
- Y. Shao, Z. Peng and J. Lee, "Full-Wave Real-Life 3-D Package Signal Integrity Analysis Using Nonconformal Domain Decomposition Method," IEEE Transactions on Microwave Theory and Techniques, vol. 59, no. 2, pp. 230-241, Feb. 2011.
Recent Courses Taught
- ECE 210 - Analog Signal Processing
- ECE 211 - Analog Circuits & Systems
- ECE 329 - Fields and Waves I
- ECE 350 X - Fields and Waves II
- ECE 498 YS3 (ECE 498 YS4, ECE 498 YVS) - Engineering EM Compatibility
- ECE 531 - Theory of Guided Waves