Sun, Jack Yuan-Chen

2010 Distinguished Alumni Award

For pioneering contributions and visionary leadership in CMOS semiconductor fabrication technology.

Jack Yuan-Chen Sun began his 30-year career in silicon chip technology with IBM, where he distinguished himself with innovative engineering contributions and technical leadership. At IBM, he led many successful projects that set world records or that shaped industry trends in CMOS, SOI, low power CMOS, bipolar, and SiGe HBT. His contributions were recognized by four IBM invention achievement awards and earned him the appointment of director of the Logic Technology Development Division.

After 14 years at IBM, Jack joined TSMC In 1997 as director of the Advanced Module Technology Division. He has been the force behind the development of many generations of cutting-edge, energy-efficient, high-performance, and high-density ASIC technologies. His leadership and vision were instrumental in enabling TSMC to become a market leader in semiconductor manufacturing.

Jack has authored or co-authored more than 200 papers. He holds multiple patents. In 2003-2004 he served as Roadmap Committee Chair of the Taiwan Semiconductor Industry Association (TSIA). He was also Taiwan’s representative on the International Roadmap Committee for the International Technology Roadmap for Semiconductors (ITRS) during that same period.

In 2000 Jack received the “Ten Most Outstanding Engineers Award” from the Chinese Institute of Engineers. That same year he was elected an IEEE Fellow. In 2003 he was co-recipient of the Outstanding Technology Worker Award from the Republic of China. He won the National Management Excellence Award in 2004.