The number of ECE ILLINOIS faculty members.
|Originating Calendar||ECE ILLINOIS Distinguished Colloquium Series|
|Speaker||Aaron Voon Yew Thean, National University of Singapore|
Grainger Auditorium, Room 1002 ECE Building
In this talk, I will first discuss some of the material trends in leading-edge semiconductor technologies base on my previous work at IMEC. We will review the role of new material engineering to enable Moore’s law driven scaling of logic and memory technologies into nanometer era of 5nm and 3nm. Among the topics, we examine the motivations for several upcoming inflections. The transition from ultra-thin FinFETs and barrier-limited wires towards Nanowires and dense barrier-free interconnects for high-performance logic. The transition from high-k metal gate FETs to possibly negative-gate-capacitance or tunnel- FETs for ultra-low energy operations. The possibility of Resistive RAMs to replace SRAMs for future neuromorphic AI chips. The advent of monolithic 3D integration that enables fine-grain logic-memory integrated 3D-ICs.
As electronics become increasingly heterogenous while the demand for lower cost, higher functionality, and demands for new form factors are calling for more innovative integration at the system level, beyond the chips. There is an increasing opportunities for new material and integration of sensors and sensor systems. A new convergence emerges with additive-based processing and advanced system-level packaging. I will describe a new research program at NUS on flexible-hybrid electronics that investigates new applications of combining rigid semiconductor components with soft materials. Besides wearable technologies, there are new applications in RF communications, robotics, and medical technologies that such technologies can enable. I will describe some of my recent research work on wearable smart medical patches, soft energy harvesting composites, and ultra-thin matrials for flexible electronics.
Prior to joining NUS in 2016, Aaron served as IMEC’s Vice President of Logic Technologies where he led IMEC’s International path-finding research consortium with industry partners that included Intel, Samsung, TSMC, Globalfoundries, Qualcomm, Apple, and Applied Materials. There, he directed the research and development of next-generation semiconductor technologies and emerging nano-device architectures including spintronics and novel materials.
Before moving to Europe, he had been with several US technology companies like Qualcomm, IBM, and Motorola. He had worked on technologies for System-On-Chip to advanced process technologies. At IBM, he led his team to develop the first foundry-compatible Gate-First High-k Metal-Gate Low-Power bulk CMOS technologies at 32nm/28nm. It enabled some of the most successful smart mobile devices in production like the iphone 5 and Apple watch.
Aaron graduated from the University of Illinois at Champaign-Urbana, USA, where he received his B.Sc. (Highest Honors & Graduated as Edmund J. James’ Scholar), M.Sc., and Ph.D. degrees (Class of 2001) in Electrical Engineering. He has published over 300 technical papers and holds more than 50 U.S. patents for inventions in the field of advanced electronics. He also serves as editor for the IEEE Electron device letters. He returned to Singapore in 2016 after 23 years in the advanced semiconductor industry, to pursue a career in academia with NUS.
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