Mindy Murdock, College Relations Manager – Intel Talent Organization
Mindy Murdock’s career spans over 20 years at the Intel Corporation where she has held a variety of technical and recruiting positions. Mindy was hired into Intel’s engineering leadership rotation program, upon completion of the program, Mindy began her career within Intel’s Internet of Things (IoT) group where she held various technical and business development positions primarily working with IoT software ecosystems. While in IoT she was very active in University Programs and recruiting. This passion for recruiting led her to the position she holds today within the global talent organization where she is focused on finding the key, critical US Recent College Graduate technical talent to meet Intel’s global needs with an emphasis on PhD recruiting. Mindy holds a BS degree in Computer Science from the Rochester Institute of Technology
Christina Poon, Probe Product Engineer – Non-Volatile Memory Solutions Group (NSG) [University of Illinois BS EE ‘11]
Christina started at Intel in August 2011 working in Manufacturing Test to develop multi-level cell Flash Memory on industry leading lithography. As a Probe Product Engineer, her responsibilities include definition, test, and validation of wafer-level probe tests to characterize the NAND Flash across different operating conditions to maximize performance and endurance. Last July, she returned from an expat assignment in China helping to successfully convert an Intel logic fab into an industry-leading 3D NAND production facility. She currently leads probe test development on NSG’s 4th-generation 3D NAND.
Arica Schiffli, Probe Product Engineer – Non-Volatile Memory Solutions Group (NSG) [University of Illinois BS EE ‘10]
Arica interned at Intel in Folsom, California the summer of 2010 as part of the Backend Product Engineering team, and returned full-time after her final semester at University of Illinois in January 2011. She is now a Probe Product Engineer where she spends her day coding & validating test flows for NAND components at the silicon level, and mentoring junior engineers. She enjoys playing saxophone (Marching Illini alum, umgawa!), softball, cooking/eating, traveling, and connecting with, developing, and encouraging others.
Blake Schippel, Logic Design Engineer – Silicon Development Division [BS CompE ‘14]
Blake started at Intel in February of 2015, after graduating from the University of Illinois the previous year with a focus in architecture and RTL design. He joined the Omni-Path team as a logic designer and initially worked on optimizing and refining RTL for pre and post silicon testing. Blake currently manages the design, implementation, and testing of memories in one of the Omni-Path products.